- Database
- Experimentalists
- Date
- 2011-04-12
- Thickness
- 0.339 $\pm$ 0.034 ${\mu}m$
- Diameter
- 40000.0 ${\mu}m$
- Substrate material
- gold plated copper surface
- Substrate comments
- disk diameter 4cm. Kept at 15K with a model 21 CTI cold head
- Comments
- Thin film - deposition at 15 K
- Temperature
- 15.0 $\pm$ 0.1 $K$
- Time at T
- 1000.0 $s$
- Temperature max
- 15.0 $\pm$ 0.1 $K$
- Type
- vacuum
- Fluid pressure
- 1.0e-09 $hPa$
- Comments
- residual UHV vacuum gases
- Number
- 1
- Layers
-
- Layer #1 , 0.339 ${\mu}m$
- Title
- Formaldehyde vapor deposition
- Sample
- Formaldehyde amorphous (this sample)
- Processing steps
-
Step Chronology Date Type Process Changes #1 before layer formation 2011-04-12 fluid physical sublimation by gently warming paraformaldehyde from solid paraformaldehyde to H2CO gas #2 during layer formation 2011-04-12 layer formation H2CO gas (300K) deposition on sample holder at 15K under vacuum from H2CO gas to solid phase. No annealing