- Database
- Experimentalists
- Date
- 2018-04-18
- Thickness
- 2.13e-08
- Diameter
- 10.0
- Substrate material
- Silicium
- Substrate comments
- Silicium wafer Si(100) - 350 microns
- Comments
- After deposition of all the layers, the sample is annealed under vacuum at 700◦C for 20 min.
- Temperature
- 25.0 -268.1
- Temperature max
- 19.85
- Type
- ambient air
- Pressure
- 1.0
- Number
- 18
- Arrangement
- 6 successive alternate adsorbed layers of Co, Fe and Pt
- Layers