Sample
Name
Tholins LATMOS Film 95%N2:5%CH4
Date
2011-01-31
Provider
Nathalie Carrasco at LATMOS
Thickness
850.0 $\pm$ 30.0 $nm$
Surface roughness
15nm +/- 1nm
Substrate material
Si
Comments
Homogeneous organic thin film
Temperature
295.0 $\pm$ 2.0 $K$
Comments
Sample kept at ambient temperature
Type
ambient air
Fluid temperature
295.0 $\pm$ 2.0 $K$
Fluid pressure
1.0 $atm$
Title
Tholins formation by plasma discharge in a 95%N2:5%CH4 gas mixture

Produced sample

Sample
Tholins LATMOS Film 95%N2:5%CH4 (this sample)
Processing steps
Step Chronology Date Type Process Changes
#1 2011-01-31 fluid physical Co-Injection in the PAMPRE chamber of 27.5 sccm of $N_2$:$CH_4$ in a 90%:10% and of 27.5 sccm of pure $N_2$ for a total gas flow of 55sscm
#2 2011-01-31 irradiation irradiation using a RF CCP Plasma at 13.56 MHz and 30 W injected power of $CH_4$:$N_2$=5%:95% gas mixture at ambient temperature and 0.9 mbar formation of a tholins thin film on Silicon wafer
#3 2011-01-31 no Collecting the Silicon wafer with tholins thin film from the reactor (and thus exposing them to ambient air) No changes observed macroscopically. Adsorption of traces of Oxygenated species on the thin film (not affecting optical properties)